Heat sink unit for cooling a plurality of exothermic units, and electronic apparatus comprising the same

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United States of America Patent

PATENT NO 6172416
SERIAL NO

09019054

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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It is intended to provide a heat sink unit and an electronic apparatus capable of efficiently cooling a plurality of semiconductor devices and taking action for unnecessary electromagnetic waves. There are provided a plurality of fan units and electromagnetic shielding means for cutting off electromagnetic waves on a heat sink substrate. It is also provided a heat sink substrate, a unit having a fan for supplying fluid to the heat sink substrate and driving means for rotating the fan, and electromagnetic shielding means provided for the heat sink substrate.

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Patent Owner(s)

Patent OwnerAddress
MATSUSHITA ELECTRIC INDUSTRIAL CO LTDOSAKA JAPAN

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Miyahara, Masaharu Nakatsu, JP 23 222
Suga, Kenji Nakatsu, JP 9 141
Sugimoto, Kazuhiko Fukuoka, JP 73 441
Tada, Hisao Fukuoka-ken, JP 1 16
Tate, Sumio Kasuga, JP 12 286

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