Method for depositing atomized materials onto a substrate utilizing light exposure for heating
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United States of America Patent
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Jan 16, 2001
Grant Date -
N/A
app pub date -
Jan 14, 1999
filing date -
Jan 14, 1999
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The present invention is generally directed to a process and a system for forming photoresist coatings on a semiconductor wafer. In particular, according to the present invention, a solution containing a photoresist material is atomized in a reaction vessel and directed towards a semiconductor wafer. The semiconductor wafer can be preheated. The atomized liquid is heated, such as by being exposed to light energy which causes the photoresist material to form a coating on the substrate.
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