Halogen-free flameproof thermoplastic molding materials
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United States of America Patent
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Jan 16, 2001
Grant Date -
N/A
app pub date -
Jun 18, 1999
filing date -
Jun 14, 1999
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The present invention relates to halogen-free flameproof thermopolastic molding compounds which comprise an aromatic polycarbonate, a styrene-containing copolymer, a styrene-containing graft polymer, a phosphorus compound, a silicon compound, and a tetrafluoroethylene polymer. It has been found that the use of a specific type of silicon compound leads to a polymer mixture having improved stress crack resistance and impact properties. The silicon compound is represented as the following Formula (I). ##STR1## in which n and m have a value of from 5 to 8, and x and y have a value of from 1 to 5.
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