Resin composition, process for preparing the same, and laminate containing layer of said resin composition
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United States of America Patent
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Jan 16, 2001
Grant Date -
N/A
app pub date -
Mar 23, 1999
filing date -
Jul 25, 1997
priority date (Note) -
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status (Latency Note)
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Abstract
A resin composition is provided which comprises (A) a saponified ethylene-vinyl acetate copolymer (referred to as EVOH for short) with an ethylene content of 20 to 60 mole percent and a saponification degree of not less than 90 mole percent, and contains therein (B) a boron compound as an essential component, (C) acetic acid as an optional component, and at least one compound selected from among (D) an acetic acid salt and (E) a phosphoric acid compound as an essential component, the contents of the respective additive components per 100 parts by weight of EVOH (A) being as follows: boron compound (B): 0.001 to 1 part by weight on the boron basis; acetic acid (C): 0 to 0.05 part by weight; acetic acid salt (D): 0.001 to 0.05 part by weight on the metal basis; and phosphoric acid compound (E): 0.0005 to 0.05 part by weight on the phosphate radical basis. This resin composition is typically produced by bringing EVOH (A) with a water content of 20 to 80% by weight into contact with an aqueous solution containing the respective additive components mentioned above and then subjecting the thus-treated EVOH to fluidized state drying and then to stationary state drying.
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