Flip-chip having an on-chip cache memory
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United States of America Patent
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Jan 16, 2001
Grant Date -
N/A
app pub date -
Jan 8, 1999
filing date -
Jan 8, 1999
priority date (Note) -
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Abstract
A flip-chip with an on-chip cache memory device. The flip-chip includes a semiconductor substrate having first and second opposing surfaces with circuit elements formed within the first surface. A plurality of raised bump contacts are located on the first surface and connected to the circuit elements. Additionally, a plurality of electrical interconnects are located on the second surface and connected to the circuit elements. A cache memory device is electrically coupled to the plurality of electrical interconnects located on the second surface.
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