Direct backside interconnect for multiple chip assemblies
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United States of America Patent
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Jan 16, 2001
Grant Date -
N/A
app pub date -
May 28, 1997
filing date -
May 28, 1997
priority date (Note) -
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status (Latency Note)
Importance
Abstract
A plurality of integrated circuits, such as microwave monolithic integrated circuits (MMICs), is supported upon a common carrier substrate having transmission lines for interconnection of signals between terminals of any one of the MMICs and among terminals of the plurality of MMICs. Circuit terminals at the front sides of the respective MMICs are connected electrically by vias to the back sides of the respective MMICs to be adjacent conductive components of the transmission lines. Electrically conductive bumps of metal or epoxy serve to connect the vias to the conductive components of the transmission lines, and to connect also metallized regions of the MMICs to metallized regions of the substrate.
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