Lead-free solders
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United States of America Patent
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Jan 23, 2001
Grant Date -
N/A
app pub date -
Oct 12, 1999
filing date -
Dec 31, 1998
priority date (Note) -
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Abstract
Disclosed is a high strength, high fatigue resistance, and high wetting lead-free solder alloy comprising effective amounts of tin, copper, silver, bismuth, indium, and antimony and having a melting temperature between 175-215.degree. C.
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