Simultaneous diffusion bonding of an array of like parts
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United States of America Patent
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Jan 23, 2001
Grant Date -
N/A
app pub date -
Nov 12, 1998
filing date -
Nov 12, 1998
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Diffusion bonding techniques are extended to the simultaneous bonding of an array of multilevel piece parts. The problems of uneven expansion and contraction of different levels of different piece parts in the array are obviated by positioning each level of the array within a frame. The stack of frames is pinned in one corner. The opposite corner of the array has a slot at a 45.degree. angle with respect to the x and y axes of the array. The slot engages a pin and allows the entire array to expand and contract along the slot in a manner to maintain the registration of features between respective levels of each piece part.
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