Method of forming dual damascene interconnects using glue material as plug material
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United States of America Patent
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Jan 23, 2001
Grant Date -
N/A
app pub date -
May 8, 1998
filing date -
Mar 17, 1998
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An multi-level interconnection uses a glue layer material as a via plug or contact plug. An method of forming the multi-level interconnection includes: forming a first opening and a wider second opening in a dielectric layer, whereas the first opening exposes the conductive layer and the second opening is above the first opening; and filling the first opening with titanium, titanium nitride or tungsten nitride.
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