Heated stage for holding wafers during semiconductor device fabrication
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United States of America Patent
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Jan 23, 2001
Grant Date -
N/A
app pub date -
Oct 29, 1997
filing date -
Nov 22, 1996
priority date (Note) -
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Abstract
A wafer holding stage used during a semiconductor device fabricating process decreases the number of particles that accumulate on a wafer. The wafer holding stage includes a stage having an upper surface for holding a wafer and a heating element disposed inside the stage for raising temperatures of the upper surface to a holding temperature above an ambient temperature. The heating element may be a heating wire for producing heat when supplied with a electric current or a heat exchange tube for carrying a heated fluid. The wafer holding stage may further comprise a low temperature particle collector, having a surface maintained at a collecting temperature below the ambient temperature, spaced apart a small distance from the stage.
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