Laser assembly platform with silicon base
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United States of America Patent
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-
Jan 23, 2001
Grant Date -
N/A
app pub date -
Dec 11, 1997
filing date -
Dec 11, 1997
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A laser assembly including a silicon base and method are provided for assembling lasers on a platform in a reliable, low cost process that is suitable for high volume production. The platform can be a monolithic silicon base which has high thermal conductivity, a low coefficient of thermal expansion, and whose features can be formed with close tolerances in a low cost, reliable manner. Materials with similar coefficients of thermal expansion are used in order to maintain alignment during unexpected heating and cooling. Furthermore, a method is described that substantially eliminates the need for adhesives to bond laser components to a platform. The resultant laser can be very robust, stable, and can provide reliable operation over extended time periods.
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