Carrier tape and die apparatus for forming same
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jan 30, 2001
Grant Date -
N/A
app pub date -
Oct 14, 1997
filing date -
Oct 18, 1996
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A carrier tape capable of being formed by means of a die apparatus readily manufactured and exhibiting increased durability. The carrier tape is formed thereon with a plurality of receiving recesses for respectively receiving semiconductor packages therein in a manner to be spaced from each other at predetermined intervals in a longitudinal direction thereof. The receiving recesses are each provided at four corners thereof with shelf sections in a manner to be expanded outwardly from an opening of the receiving recess in a plane direction, so that the shelf sections may have an increased area. The shelf sections act to support a periphery of a bottom surface of the semiconductor package thereon. The receiving recess is also provided with positioning sections for positioning the semiconductor package in the plane direction while keeping sides of the semiconductor package in contact therewith. The positioning sections are respectively arranged between an adjacent two of the shelf sections.
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