Method and apparatus for treating surface including virtual anode
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United States of America Patent
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Jan 30, 2001
Grant Date -
N/A
app pub date -
Nov 13, 1997
filing date -
Nov 13, 1997
priority date (Note) -
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Abstract
An apparatus for depositing an electrical conductive layer on the surface of a wafer includes a virtual anode located between the actual anode and the wafer. The virtual anode modifies the electric current flux and plating solution flow between the actual anode and the wafer to thereby modify the thickness profile of the deposited electrically conductive layer on the wafer. The virtual anode can have openings through which the electrical current flux passes. By selectively varying the radius, length, or both, of the openings, any desired thickness profile of the deposited electrically conductive layer on the wafer can be readily obtained.
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