Process for manufacturing compression-molded candy

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United States of America Patent

PATENT NO 6180152
SERIAL NO

09401759

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Abstract

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The present invention provides a method for manufacturing compression-molded candy comprising the steps of mixing and dissolving conventional candy mixture at a temperature of 100 to 120.degree. C., concentrating the candy mixture to a water content of below 2.0% under the conditions of a temperature of 130 to 160.degree. C., steam pressure of 4.0 to 9.5 kgf/cm.sup.3, and vacuum pressure of 100 to 700 mmHg, adding the conventional additives thereto, maintaining the candy mixture at a temperature of below 80.degree. C., and molding the candy mixture by pressure packing at a pressure of 10 to 50 kgf/cm.sup.3 within 5 to 30 seconds. By lowering the ratio of water content to below 2% and pressure packing the mixture at high pressure and low temperatures, it is possible to manufacture candies of various distinct shapes stable despite changes in the outer environment.

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Patent Owner(s)

Patent OwnerAddress
JEONG WOO CONFECTIONARY CO LTDMANAN-GU ANYANG-CITY NO 158-1 BARKDAL-DONG KYUNGKI-DO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Yoon, Seung Hong Seoul, KR 1 5

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