Importance

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Abstract

A self-doping electrode to silicon is formed primarily from a metal (major component) which forms a eutectic with silicon. A p-type dopant (for a positive electrode) or an n-type dopant (for a negative electrode) is alloyed with the major component. The alloy of major component and dopant is applied to a silicon substrate. Once applied, the alloy and substrate are heated to a temperature above the major component-silicon eutectic temperature such that the major component liquefies more than a eutectic proportion of the silicon substrate. The temperature is then decreased towards the eutectic temperature permitting molten silicon to reform through liquid-phase epitaxy and while so doing incorporate dopant atoms into its regrown lattice. Once the temperature drops below the major component-silicon eutectic temperature the silicon, which has not already regrown into the lattice, forms a solid-phase alloy with the major component and the remaining unused dopant. This alloy of major component, silicon and unused dopant is the final contact material. Alternatively, a self-doping electrode may be formed from an unalloyed metal applied to a silicon substrate. The metal and substrate are heated to a temperature above the metal-silicon eutectic temperature in an ambient gas into which a source of vaporized dopant atoms has been introduced. Dopant atoms in the ambient gas are absorbed by the molten mixture of metal-silicon to a much greater extent than they are absorbed by the solid silicon substrate surfaces. The temperature is then decreased to below the metal-silicon eutectic temperature. During this temperature decrease, the doped regrown silicon layer and the metal-silicon alloy final contact material are created in the same process as described above.

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First Claim