Semiconductor device having a plurality of semiconductor chips
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United States of America Patent
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Jan 30, 2001
Grant Date -
N/A
app pub date -
Dec 13, 1999
filing date -
Dec 22, 1998
priority date (Note) -
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Abstract
A semiconductor device includes an insulative substrate having a layer of interconnection patterns formed on a chip-side surface and external terminals formed on the opposite surface, and a plurality of semiconductor chips stacked on the chip-side surface of the insulative substrate. In the semiconductor device, among the plurality of semiconductor chips, a semiconductor chip having the largest plan surface area has the greatest thickness.
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