Thermally conductive mounting arrangement for securing an integrated circuit package to a heat sink
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United States of America Patent
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-
Jan 30, 2001
Grant Date -
N/A
app pub date -
May 28, 1998
filing date -
May 28, 1998
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An electrical assembly includes an IC package having a thermally conductive mounting flange in contact with a heat sink. A thermally conductive casing is secured to the heat sink, the casing at least partially enclosing the IC package. A resilient retaining member is disposed between the casing and IC package, the retaining member applying sufficient force on the IC package so as to maintain good thermal contact between the mounting flange and heat sink.
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