Digital subscriber line (xDSL) modem having a multi-layer electromagnetic shield and method of manufacture
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United States of America Patent
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-
Jan 30, 2001
Grant Date -
N/A
app pub date -
Jun 19, 1998
filing date -
Jun 19, 1998
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
An xDSL modem assembly is provided. The assembly comprises a housing, a circuit board having xDSL electronics, and a multi-layer electromagnetic shield formed to receive the circuit board. The circuit board is positioned inside the multi-layer electromagnetic shield, and the multi-layer electromagnetic shield is positioned inside the housing.
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