Metal layer assignment

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United States of America Patent

PATENT NO 6182272
SERIAL NO

09118661

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Routing layers are assigned to connection segments in integrated circuit design. A routing description that includes connection segments and a vertex where at least two of the connection segments connect to each other is obtained. A penalty is determined for the vertex based on a potential layer assignment combination for the connection segments that connect at the vertex, and routing layers are assigned to the connection segments based on the determined penalty.

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Patent Owner(s)

  • BELL SEMICONDUCTOR, LLC

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Andreev, Alexander San Jose, CA 47 733
Pavisic, Ivan San Jose, CA 56 1754
Raspopovic, Pedja Cupertino, CA 19 1295

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