Apparatus and methods for separating microelectronic packages from a common substrate
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United States of America Patent
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-
Feb 6, 2001
Grant Date -
N/A
app pub date -
Mar 4, 1998
filing date -
Mar 4, 1997
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An apparatus for excising microelectronic packages assembled to a common substrate includes a mechanical element which travels over a path defined on the common substrate, a castor element pivotally mounted to the mechanical element for movement about a pivot axis, and a cutting wheel rotatably mounted to the castor element so as to provide a castoring action for the cutting wheel. The cutting wheel has an asymmetrical cutling edge which selectively engages the common substrate so that when the mechanical element guides the cutting wheel over the path, the cutting edge severs the common substrate to provide one or more of the microelectronic packages separate from one another.
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