I.C. carrier insert
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United States of America Patent
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Feb 6, 2001
Grant Date -
N/A
app pub date -
Apr 10, 1998
filing date -
Apr 11, 1997
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An insert for use within integrated circuit (IC) chip carriers to provide universality across device types and applications at a low design and fabrication cost. The present invention functions as a generic carrier floor and/or adaptor insert which enables reception of both quad-flat-pack (QFP) and thin-quad-flat-pack (TQFP) ICs within frames of a variety of existing carriers, or alternatively, may allow both QFP and TQFP ICs to utilize a single IC carrier frame, a feature which currently prevailing embodiments would require two unique IC carriers.
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