Aqueous solutions for obtaining metals by reductive deposition

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 6183545
SERIAL NO

09340894

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

An aqueous solution for the reductive deposition of metals comprising, besides water, (A) a phosphine of the general formula (1) ##STR1## in which R.sub.1, R.sub.2, and R.sub.3 denote lower alkyl groups, at least one of which being hydroxy-or amino-substituted lower alkyl group, and (B) a soluble compound of a metal or a compound of a metal solubilized through the formation of a soluble complex by said phosphine.

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

Patent OwnerAddress
DAIWA FINE CHEMICALS CO LTDAKASHI-SHI HYOGO-KEN

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kato, Yuji Akashi, JP 125 1478
Kohashi, Yasuhito Akashi, JP 2 79
Komatsu, Mitsuo Ibaraki, JP 3 72
Kondo, Tetsuya Akashi, JP 203 1637
Kuba, Kyoko Akashi, JP 1 60
Nawafune, Hidemi Takatsuki, JP 25 294
Nishino, Masayuki Akashi, JP 12 97
Obata, Keigo Akashi, JP 20 339
Okuhama, Yoshiaki Akashi, JP 11 190
Shiomi, Keiji Akashi, JP 1 60
Takatani, Shigeru Akashi, JP 1 60
Takeuchi, Takao Akashi, JP 27 469
Tanaka, Emiko Akashi, JP 2 81
Yoshimoto, Masakazu Akashi, JP 42 688

Cited Art Landscape

Load Citation

Patent Citation Ranking

Forward Cite Landscape

Load Citation