Method and apparatus for the disposal of processing fluid used to deposit and/or remove material on a substrate
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United States of America Patent
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Feb 6, 2001
Grant Date -
N/A
app pub date -
Jul 17, 1998
filing date -
Jul 17, 1998
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A fluid containment ring for use in a processing chamber used to deposit a material onto a semiconductor wafer and/or remove material from a wafer by subjecting the wafer to an electric field and an electrolyte is described. The fluid containment ring is located at the base of the processing chamber in close proximity to the outside edge of the wafer being processed in the processing chamber. After each processing step is completed, the used electrolyte is diverted from the processing chamber into the fluid containment ring for containment such that no electrolyte contacts the unprocessed side (or back) of the wafer. One or more drains coupled to the fluid containment ring provide means for disposal and/or recirculation of the electrolyte.
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