Semiconductor die back side surface and method of fabrication

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 6184064
SERIAL NO

09481947

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A method of physically altering the backside surface of a semiconductor wafer or other substrate, and resulting article, to improve adhesion between the backside surface of semiconductor dice singulated from the wafer and a die attach adhesive or encapsulation compound. The physically altered backside surface reduces or substantially eliminates delamination and cracking damage in a semiconductor die assembly due to semiconductor wafer tape contamination and subsequent moisture penetration. The physically altered backside surface further reduces both semiconductor wafer tape contamination and shear stress along the interface between the semiconductor die backside surface and the die attach adhesive or encapsulation compound.

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First Claim

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Patent Owner(s)

Patent OwnerAddressTotal Patents
MICRON TECHNOLOGY, INC.BOISE, ID19009

International Classification(s)

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  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Cobbley, Chad A Boise, ID 127 1771
Jiang, Tongbi Boise, ID 324 4042

Cited Art Landscape

Patent Info (Count) # Cites Year
 
Minnesota Mining and Manufacturing Company (1)
5851664 Semiconductor wafer processing adhesives and tapes 134 1997
 
INTERNATIONAL BUSINESS MACHINES CORPORATION (1)
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Other [Check patent profile for assignment information] (2)
5643044 Automatic chemical and mechanical polishing system for semiconductor wafers 133 1994
5836807 Method and structure for polishing a wafer during manufacture of integrated circuits 36 1996
 
Mitsubishi Materials Silicon Corp. (1)
5618227 Apparatus for polishing wafer 63 1995
 
WACKER SILTRONIC GESELLSCHAFT FUR HALBLETERMATERIALIEN AG (1)
4587771 Process for the backside-gettering surface treatment of semiconductor wafers 12 1982
 
FREESCALE SEMICONDUCTOR, INC. (1)
5756380 Method for making a moisture resistant semiconductor device having an organic substrate 68 1995
 
MICRON TECHNOLOGY, INC. (3)
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5583372 Adhesion enhanced semiconductor die for mold compound packaging 25 1994
5827111 Method and apparatus for grinding wafers 23 1997
 
Nippondenso Co., Ltd. (1)
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KOBE PRECISION INC. (1)
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GLOBALFOUNDRIES INC. (1)
5780204 Backside wafer polishing for improved photolithography 8 1997
 
FUJITSU LIMITED (3)
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MOTOROLA, INC. (1)
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LINTEC CORPORATION (1)
4756968 Adhesive sheets 44 1986
 
FLIPCHIP INTERNATIONAL (1)
5632667 No coat backside wafer grinding process 31 1995
 
INTEL CORPORATION (1)
* 6027659 Polishing pad conditioning surface having integral conditioning points 53 1997
 
TEXAS INSTRUMENTS INCORPORATED (2)
5197271 Method and apparatus for back side damage of silicon wafers 4 1981
5313102 Integrated circuit device having a polyimide moisture barrier coating 30 1989
 
PROMOS TECHNOLOGIES INC. (1)
* 5989971 Method for forming trenched polysilicon structure 4 1997
 
LAPIS SEMICONDUCTOR CO., LTD. (1)
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NEC ELECTRONICS CORPORATION (1)
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* Cited By Examiner

Patent Citation Ranking

Forward Cite Landscape

Patent Info (Count) # Cites Year
 
Other [Check patent profile for assignment information] (4)
* 2004/0154,956 Stacked die module and techniques for forming a stacked die module 1 2004
* 2004/0155,327 Stacked die module and techniques for forming a stacked die module 5 2004
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SEIKO EPSON CORPORATION (1)
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6682955 Stacked die module and techniques for forming a stacked die module 12 2002
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SAMSUNG ELECTRONICS CO., LTD. (4)
7355176 Method of forming TEM specimen and related protection layer 0 2005
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INTEL MOBILE COMMUNICATIONS GMBH (2)
7508083 Electronic component comprising a semiconductor chip and a plastic housing, and method for producing the same 0 2004
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NEC CORPORATION (1)
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STATS CHIPPAC PTE. LTE. (5)
7892072 Method for directional grinding on backside of a semiconductor wafer 2 2007
* 9431316 Semiconductor device and method of forming channels in back surface of FO-WLCSP for heat dissipation 0 2010
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8994196 System and method for directional grinding on backside of a semiconductor wafer 0 2011
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APPLE INC. (1)
* 2010/0117,963 Generating Gestures Tailored to a Hand Resting on a Surface 4 2008
 
AMKOR TECHNOLOGY, INC. (3)
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BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT (1)
* 2011/0079,901 Methods of Forming Back Side Layers For Thinned Wafers and Related Structures 0 2010
 
HYUNDAI ELECTRONICS INDUSTRIES CO., LTD. (2)
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6828686 Chip size stack package and method of fabricating the same 12 2003
 
ADVANCED SEMICONDUCTOR ENGINEERING, INC. (1)
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SHARP KABUSHIKI KAISHA (1)
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ADVANCED MICRO DEVICES, INC. (1)
* 6661102 Semiconductor packaging apparatus for controlling die attach fillet height to reduce die shear stress 5 2002
 
U.S. BANK NATIONAL ASSOCIATION (3)
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QORVO US, INC. (2)
8274162 Apparatus and method for reduced delamination of an integrated circuit module 4 2007
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INTERNATIONAL RECTIFIER CORPORATION (2)
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SILICONWARE PRECISION INDUSTRIES CO., LTD. (3)
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8895366 Fabrication method of semiconductor package 0 2014
 
GLOBALFOUNDRIES INC. (4)
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NXP USA, INC. (4)
* 9099567 Packaged semiconductor devices and methods of their fabrication 2 2013
* 2015/0146,399 PACKAGED SEMICONDUCTOR DEVICES AND METHODS OF THEIR FABRICATION 4 2013
9698116 Thick-silver layer interface for a semiconductor die and corresponding thermal layer 0 2014
9425161 Semiconductor device with mechanical lock features between a semiconductor die and a substrate 0 2015
 
SHINKO ELECTRIC INDUSTRIES CO., LTD. (2)
* 7134195 Method of production of multilayer circuit board with built-in semiconductor chip 6 2004
* 2004/0188,136 Method of production of multilayer circuit board with built-in semiconductor chip 3 2004
 
INFINEON TECHNOLOGIES AG (2)
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ANALOG DEVICES, INC. (2)
9343367 Integrated device die and package with stress reduction features 1 2014
9698127 Integrated device die and package with stress reduction features 0 2016
 
CONTINENTAL AUTOMOTIVE SYSTEMS, INC. (3)
8618675 Thin semiconductor die package 1 2011
* 9676618 Embedded structures for high glass strength and robust packaging 0 2015
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INTEL CORPORATION (14)
7145249 Semiconducting device with folded interposer 13 2004
* 2005/0212,112 Semiconducting device with folded interposer 3 2004
7378725 Semiconducting device with stacked dice 4 2004
* 2005/0224,943 Semiconducting device with stacked dice 1 2004
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7498201 Method of forming a multi-die semiconductor package 2 2005
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7482698 Semiconducting device with folded interposer 0 2006
7456048 Semiconducting device with folded interposer 0 2006
* 2007/0023,905 SEMICONDUCTING DEVICE WITH FOLDED INTERPOSER 3 2006
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MITSUBISHI ELECTRIC CORPORATION (1)
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TEXAS INSTRUMENTS INCORPORATED (2)
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SANDISK SEMICONDUCTOR (SHANGHAI) CO., LTD. (1)
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Phoenix Precision Technology Corporation (2)
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6683379 Semiconductor device with reinforcing resin layer 14 2002
* Cited By Examiner