US Patent No: 6,184,064

Number of patents in Portfolio can not be more than 2000

Semiconductor die back side surface and method of fabrication

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Abstract

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A method of physically altering the backside surface of a semiconductor wafer or other substrate, and resulting article, to improve adhesion between the backside surface of semiconductor dice singulated from the wafer and a die attach adhesive or encapsulation compound. The physically altered backside surface reduces or substantially eliminates delamination and cracking damage in a semiconductor die assembly due to semiconductor wafer tape contamination and subsequent moisture penetration. The physically altered backside surface further reduces both semiconductor wafer tape contamination and shear stress along the interface between the semiconductor die backside surface and the die attach adhesive or encapsulation compound.

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Patent Owner(s)

Patent OwnerAddressTotal Patents
MICRON TECHNOLOGY, INC.BOISE, ID21633

International Classification(s)

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  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Cobbley, Chad A Boise, ID 174 1352
Jiang, Tongbi Boise, ID 420 2987

Cited Art Landscape

Patent Info (Count) # Cites Year
 
FUJITSU LIMITED (3)
5,504,022 Method of making a semiconductor memory device having a floating gate 28 1993
5,753,535 Leadframe and resin-sealed semiconductor device 9 1994
5,930,603 Method for producing a semiconductor device 39 1997
 
MICRON TECHNOLOGY, INC. (3)
5,223,734 Semiconductor gettering process using backside chemical mechanical planarization (CMP) and dopant diffusion 33 1991
5,583,372 Adhesion enhanced semiconductor die for mold compound packaging 23 1994
5,827,111 Method and apparatus for grinding wafers 22 1997
 
TEXAS INSTRUMENTS INCORPORATED (2)
5,197,271 Method and apparatus for back side damage of silicon wafers 4 1981
5,313,102 Integrated circuit device having a polyimide moisture barrier coating 28 1989
 
FLIPCHIP INTERNATIONAL (1)
5,632,667 No coat backside wafer grinding process 29 1995
 
FREESCALE SEMICONDUCTOR, INC. (1)
5,756,380 Method for making a moisture resistant semiconductor device having an organic substrate 60 1995
 
GLOBALFOUNDRIES INC. (1)
5,780,204 Backside wafer polishing for improved photolithography 8 1997
 
INTEL CORPORATION (1)
6,027,659 Polishing pad conditioning surface having integral conditioning points 35 1997
 
INTERNATIONAL BUSINESS MACHINES CORPORATION (1)
5,773,362 Method of manufacturing an integrated ULSI heatsink 37 1997
 
KOBE PRECISION INC. (1)
5,622,875 Method for reclaiming substrate from semiconductor wafers 43 1994
 
LAPIS SEMICONDUCTOR CO., LTD. (1)
5,864,174 Semiconductor device having a die pad structure for preventing cracks in a molding resin 26 1996
 
LINTEC CORPORATION (1)
4,756,968 Adhesive sheets 44 1986
 
Minnesota Mining and Manufacturing Company (1)
5,851,664 Semiconductor wafer processing adhesives and tapes 61 1997
 
MITSUBISHI MATERIALS SILICON CORPORATION (1)
5,618,227 Apparatus for polishing wafer 63 1995
 
MOTOROLA, INC. (1)
5,554,569 Method and apparatus for improving interfacial adhesion between a polymer and a metal 21 1994
 
NEC ELECTRONICS CORPORATION (1)
4,782,029 Method of gettering semiconductor wafers with an excimer laser beam 27 1987
 
Nippondenso Co., Ltd. (1)
5,242,862 Semiconductor device and method of manufacturing same 19 1991
 
PROMOS TECHNOLOGIES INC. (1)
5,989,971 Method for forming trenched polysilicon structure 3 1997
 
WACKER SILTRONIC GESELLSCHAFT FUR HALBLEITERMATERIALIEN AKTIENGESELLSCHAFT (1)
4,587,771 Process for the backside-gettering surface treatment of semiconductor wafers 12 1982
 
Other [Check patent profile for assignment information] (2)
5,643,044 Automatic chemical and mechanical polishing system for semiconductor wafers 129 1994
5,836,807 Method and structure for polishing a wafer during manufacture of integrated circuits 34 1996

Patent Citation Ranking

Forward Cite Landscape

Patent Info (Count) # Cites Year
 
MICRON TECHNOLOGY, INC. (22)
6,548,376 Methods of thinning microelectronic workpieces 62 2001
6,812,064 Ozone treatment of a ground semiconductor die to improve adhesive bonding to a substrate 5 2001
6,682,955 Stacked die module and techniques for forming a stacked die module 12 2002
6,927,497 Multi-die semiconductor package 6 2002
6,934,928 Method and apparatus for designing a pattern on a semiconductor surface 9 2002
6,898,779 Pattern generation on a semiconductor surface 4 2002
7,170,184 Treatment of a ground semiconductor die to improve adhesive bonding to a substrate 0 2003
6,879,050 Packaged microelectronic devices and methods for packaging microelectronic devices 3 2003
7,755,204 Stacked die module including multiple adhesives that cure at different temperatures 1 2003
7,064,069 Substrate thinning including planarization 2 2003
6,940,181 Thinned, strengthened semiconductor substrates and packages including same 18 2003
7,217,596 Stacked die module and techniques for forming a stacked die module 45 2004
7,029,931 Stacked die module and techniques for forming a stacked die module 1 2004
7,370,306 Method and apparatus for designing a pattern on a semiconductor surface 1 2004
7,244,663 Wafer reinforcement structure and methods of fabrication 1 2004
7,262,488 Substrate with enhanced properties for planarization 0 2004
7,056,812 Process for strengthening semiconductor substrates following thinning 1 2004
7,290,242 Pattern generation on a semiconductor surface 1 2005
7,186,576 Stacked die module and techniques for forming a stacked die module 2 2005
7,427,811 Semiconductor substrate 3 2006
7,332,413 Semiconductor wafers including one or more reinforcement structures and methods of forming the same 2 2006
7,851,266 Microelectronic device wafers including an in-situ molded adhesive, molds for in-situ molding adhesives on microelectronic device wafers, and methods of molding adhesives on microelectronic device wafers 0 2008
 
INTEL CORPORATION (6)
7,145,249 Semiconducting device with folded interposer 9 2004
7,378,725 Semiconducting device with stacked dice 4 2004
7,498,201 Method of forming a multi-die semiconductor package 2 2005
7,482,698 Semiconducting device with folded interposer 0 2006
7,456,048 Semiconducting device with folded interposer 0 2006
8,222,118 Wafer backside grinding with stress relief 0 2008
 
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (3)
6,350,664 Semiconductor device and method of manufacturing the same 50 2000
6,797,544 Semiconductor device, method of manufacturing the device and method of mounting the device 20 2001
6,683,379 Semiconductor device with reinforcing resin layer 13 2002
 
AMKOR TECHNOLOGY, INC. (2)
7,871,899 Methods of forming back side layers for thinned wafers 3 2007
8,643,177 Wafers including patterned back side layers thereon 0 2010
 
HYUNDAI ELECTRONICS INDUSTRIES CO., LTD. (2)
6,589,813 Chip size stack package and method of fabricating the same 8 2000
6,828,686 Chip size stack package and method of fabricating the same 8 2003
 
SAMSUNG ELECTRONICS CO., LTD. (2)
7,355,176 Method of forming TEM specimen and related protection layer 0 2005
7,297,950 Transmission electron microscope specimen and method of manufacturing the same 1 2005
 
TEXAS INSTRUMENTS INCORPORATED (2)
6,686,225 Method of separating semiconductor dies from a wafer 29 2001
6,541,352 Semiconductor die with contoured bottom surface and method for making same 5 2001
 
ADVANCED MICRO DEVICES, INC. (1)
6,661,102 Semiconductor packaging apparatus for controlling die attach fillet height to reduce die shear stress 2 2002
 
CONTINENTAL AUTOMOTIVE SYSTEMS, INC. (1)
8,618,675 Thin semiconductor die package 0 2011
 
GLOBALFOUNDRIES INC. (1)
7,259,458 Integrated circuit with increased heat transfer 2 2005
 
INTEL MOBILE COMMUNICATIONS GMBH (1)
7,508,083 Electronic component comprising a semiconductor chip and a plastic housing, and method for producing the same 0 2004
 
INTERNATIONAL BUSINESS MACHINES CORPORATION (1)
7,329,948 Microelectronic devices and methods 0 2004
 
INTERNATIONAL RECTIFIER CORPORATION (1)
8,629,566 Semiconductor multichip module package with improved thermal performance; reduced size and improved moisture resistance 0 2005
 
PHOENIX PRECISION TECHNOLOGY CORPORATION (1)
7,629,204 Surface roughening method for embedded semiconductor chip structure 0 2006
 
SEIKO EPSON CORPORATION (1)
7,402,503 Dicing sheet, manufacturing method thereof, and manufacturing method of semiconductor apparatus 3 2005
 
SHARP KABUSHIKI KAISHA (1)
7,692,312 Semiconductor device having reinforcement member and method of manufacturing the same 0 2006
 
SHINKO ELECTRIC INDUSTRIES CO., LTD. (1)
7,134,195 Method of production of multilayer circuit board with built-in semiconductor chip 5 2004
 
SILICONWARE PRECISION INDUSTRIES CO., LTD. (1)
8,698,326 Semiconductor package and fabrication method thereof 0 2007
 
STATS CHIPPAC LTD. (1)
7,892,072 Method for directional grinding on backside of a semiconductor wafer 0 2007
 
TRIQUINT SEMICONDUCTOR, INC. (1)
8,274,162 Apparatus and method for reduced delamination of an integrated circuit module 0 2007
 
Other [Check patent profile for assignment information] (1)
8,895,366 Fabrication method of semiconductor package 0 2014