Methods of making microelectronic packages utilizing coining
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Feb 6, 2001
Grant Date -
N/A
app pub date -
Jan 28, 2000
filing date -
Dec 13, 1996
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A package for a microelectronic element is made by making a microelectronic component, including embossing a metal sheet to form thin and thick regions, then etching or otherwise removing metal from the sheet in a nonselective removal process and arresting the removal process when the thin regions are removed but before the thick regions are removed. A base material may be applied to the metal sheet to form a dielectric layer for the component. The component is assembled with a microelectronic element to form the package.
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