Integrated circuit package for flip chip
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United States of America Patent
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-
Feb 6, 2001
Grant Date -
N/A
app pub date -
Apr 13, 1998
filing date -
Apr 13, 1998
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
An integrated circuit package includes a ceramic substrate having a cut out configured to receive a flip chip. The cut out includes vias formed as through holes. A flip chip is received within the cut out of the ceramic substrate and has conductive bumps formed thereon corresponding to the electrical input/output contacts of the flip chip. The conductive bumps are received within the through holes of the ceramic substrate. A second integrated circuit chip is mounted on the flip chip in back-to-back relationship. A controlled impedance line is secured to the conductive bumps and acts as a coax. In another aspect of the present invention, a heat sink can be mounted on the back of the flip chip, and the second integrated circuit chip mounted on the heat sink.
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