Film capacitor and semiconductor package or device carrying same
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United States of America Patent
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-
Feb 6, 2001
Grant Date -
N/A
app pub date -
Nov 6, 1997
filing date -
Nov 8, 1996
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A thin film capacitor comprises a substrate having first and second surfaces, a first electrode film formed on the first surface of the substrate, a high-dielectric film formed on the first electrode film, a second electrode film formed on said high-dielectric film, first and second external connection terminals formed on the second surface of the substrate opposite to the first surface on which the first electrode film is formed in such a manner that the first and second external connection terminals are electrically connected to the first and second electrode films, respectively.
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