Photolithographically patterned spring contact
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United States of America Patent
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-
Feb 6, 2001
Grant Date -
N/A
app pub date -
Dec 14, 1998
filing date -
Jun 7, 1995
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A photolithographically patterned spring contact is formed on a substrate and electrically connects contact pads on two devices. The spring contact also compensates for thermal and mechanical variations and other environmental factors. An inherent stress gradient in the spring contact causes a free portion of the spring contact to bend up and away from the substrate. An anchor portion remains fixed to the substrate and is electrically connected to a first contact pad on the substrate. The spring contact is made of an elastic material and the free portion compliantly contacts a second contact pad, thereby electrically interconnecting the two contact pads.
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