Semiconductor device manufacturing method, manufacturing apparatus, simulation method and simulator

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United States of America Patent

PATENT NO 6185472
SERIAL NO

08777189

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Abstract

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A semiconductor device manufacturing method capable of proceeding semiconductor device manufacturing processes according to predetermined schedules or while correcting them without testpieces is provided. The method includes the steps of collecting actually observed data during at least one of plural steps, obtaining prediction data in at least one of plural steps by using an ab initio molecular dynamics process simulator or a molecular dynamics simulator, comparing and verifying the prediction data and the actually observed data sequentially at real time, and correcting and processing the plural manufacturing process factors sequentially at real time if a difference in significance is recognized between set values for the plural manufacturing process factors and the plural manufacturing process factors estimated from the actually observed data according to comparison and verification.

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Patent Owner(s)

Patent OwnerAddress
KABUSHIKI KAISHA TOSHIBAMINATO-KU TOKYO 105-8001

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Okada, Takako Tokyo, JP 7 196
Okano, Haruo Chiba, JP 90 4214
Onga, Shinji Kanagawa, JP 6 160
Tomita, Hiroshi Kanagawa, JP 319 4120
Yamabe, Kikuo Ibaraki, JP 21 667

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