Method of fabrication of multiple-layer high density substrate
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United States of America Patent
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Feb 13, 2001
Grant Date -
N/A
app pub date -
Sep 14, 1998
filing date -
Sep 14, 1998
priority date (Note) -
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Abstract
A method of fabricating a multi-layer interconnected substrate structure. The inventive method includes forming a multi-layer structure from multiple, pre-fabricated power and/or signal substrates which are laminated together. A drill is then used to form a via through the surface of a ring-type pad down to a desired depth in the multi-layer structure. The via hole is cleaned and then filled with a conductive material. The via so formed between two or more substrates is self-aligned by using the ring pad(s). This contributes to an increased signal routing density compared to conventional methods.
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