Exposed heat spreader with seal ring
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United States of America Patent
Stats
-
Feb 13, 2001
Grant Date -
N/A
app pub date -
Jun 14, 1999
filing date -
Jun 14, 1999
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A semiconductor package comprising: (a) at least one semiconductor device; (b) a metal heat spreader that has at least one surface exposed to ambient and the perimeter of that exposed surface having a seal ring border; (c) a leadframe having a plurality of inner and outer leads, said inner leads interconnected to said semiconductor device; and (d) a molding resin encapsulating said semiconductor device, said inner leads of said leadframe and all of the heat spreader except that exposed surface having the seal ring border.
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