Method and apparatus for leveling the upper surface of a PCB
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United States of America Patent
Stats
-
Feb 20, 2001
Grant Date -
N/A
app pub date -
May 5, 1998
filing date -
May 5, 1998
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A platform and method for leveling the upper surface of a printed circuit board placed upon a work table. The platform comprises a substantially flat plate, the plate having a fastener for planerly securing the printed circuit board thereto, and at least one support having a length between a first end and a second end, the second end of the at least one support attached to the plate, and wherein the length of the at least one support is selected such that an angle between the plate and the work table compensates for any angular displacement of the printed circuit board relative to the plate. The method comprises fastening the printed circuit board to a platform, securing the platform to the work table, and angularly adjusting the upper surface of the printed circuit board by altering an angle between the platform and the work table.
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