Developing method and apparatus
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Feb 20, 2001
Grant Date -
N/A
app pub date -
Jan 4, 1998
filing date -
Jan 9, 1998
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
After a developer is applied to a semiconductor wafer, a head member having a plurality of fluid discharge holes is positioned so as to face the wafer, and during development of the wafer, a fluid is discharged from the discharge holes of the head member toward the developer on the wafer. By supplying the fluid to a region of the wafer where the line widths of the resulting circuit pattern are liable to become uneven, the temperature, thickness, liquid surface state, etc. of the developer in this region are controlled.
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