Endpoint detection with light beams of different wavelengths
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United States of America Patent
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Feb 20, 2001
Issued Date -
N/A
app pub date -
Apr 27, 1999
filing date -
Jan 25, 1999
priority date (Note) -
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Abstract
A chemical mechanical polishing apparatus includes two optical systems which are used serially to determine polishing endpoints. The first optical system includes a first light source to generate a first light beam which impinges on a surface of the substrate, and a first sensor to measure light reflected from the surface of the substrate to generate a measured first interference signal. The second optical system includes a second light source to generate a second light beam which impinges on a surface of the substrate and a second sensor to measure light reflected from the surface of the substrate to generate a measured second interference signal. The second light beam has a wavelength different from the first light beam.
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