Method of manufacturing a warp resistant thermally conductive circuit package
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United States of America Patent
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Feb 20, 2001
Issued Date -
N/A
app pub date -
Jul 14, 1998
filing date -
Mar 12, 1997
priority date (Note) -
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Abstract
An integrated circuit package for improved warp resistance and heat dissipation is described. The LOC package includes: an integrated circuit die having an upper, active face, and a multi-layered, substantially planar lead frame mounted to the active face of the die, where the lead frame is preferably comprised of layers configured as Cu/INVAR/Cu or Cu/Alloy 42/Cu. The choice of the middle layer of the lead frame is selected to minimize the warping forces on the package such that the coefficient of thermal expansion of the composite lead frame approximates that of silicon. The copper layers of the lead frame provide improved heat dissipation.
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