Mass reflowable windowed package

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 6191359
SERIAL NO

09172710

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

A windowed package is capable of withstanding a mass reflow process. During mass reflow, the entire package is subjected to the solder reflow temperature. In one embodiment, the lid comprises a ceramic frame and a glass window.

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

Patent OwnerAddress
INTEL CORPORATION2200 MISSION COLLEGE BOULEVARD SANTA CLARA CA 95054

International Classification(s)

  • [Classification Symbol]
  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Arellano, Raul A Phoenix, AZ 1 45
Nagai, Naoyuki Kagoshima, JP 16 80
Nomoto, Kouichiro Kagoshima, JP 1 45
Sengupta, Kabul S Tempe, AZ 2 60
Sklenicka, Carl E Phoenix, AZ 1 45
Takehashi, Nobuyuki Shinga, JP 2 58
Thompson, Deborah L Tempe, AZ 6 121

Cited Art Landscape

Load Citation

Patent Citation Ranking

Forward Cite Landscape

Load Citation