Hole geometry of a semiconductor package substrate
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United States of America Patent
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-
Feb 20, 2001
Grant Date -
N/A
app pub date -
Jan 5, 1999
filing date -
Jan 5, 1999
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A semiconductor package substrate includes at least one insulative layer, at least two metal lines next to one another on a first side of the insulative layer, and a first metal layer on a second side of the insulative layer opposing the first side. An opening is formed in the first metal layer in an area between the metal lines. Two lands remain part of the first metal layer. The lands are located adjacent the opening and each land opposes a respective one of the metal lines located next to one another.
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