Bonding lead structure with enhanced encapsulation
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United States of America Patent
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-
Feb 20, 2001
Grant Date -
N/A
app pub date -
May 20, 1999
filing date -
Dec 13, 1996
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A connection component for a semiconductor chip includes a support structure having a top surface including a dielectric material and a bottom surface. The support structure includes a central portion, a peripheral portion and one or more gaps extending substantially between the central portion and the peripheral portion. A bus overlies the top surface of the support structure. The each bus has an outer edge which overlies the peripheral portion of the support structure and an inner edge which overlies the one or more gaps. The support structure also includes one or more electrically conductive leads having first ends secured to the central portion and second ends overlying the gaps and being secured to the inner edge of the bus. The second ends of the leads are displaceable relative to the bus in response to bonding forces being applied to the leads for engaging contacts on a semiconductor chip.
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