Technique for producing interconnecting conductive links

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United States of America Patent

PATENT NO 6191486
SERIAL NO

09285526

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Conductive links are provided between conductive materials, e.g., metals, separated by a non-conductive material, e.g., a silicon based glass material. In a preferred embodiment a single pulse of laser energy is applied to at least one of the conductive materials to produce mechanical strain therein which strain initiates a fracturing of the non-conductive material so as to provide at least one fissure therein extending between the conductive materials. The laser energy pulse further causes at least one of the conductive materials to flow in such fissure to provide a conductive link between the conductive materials. Preferably, the non-conductive material is formed in layers such that an interface between the layers controls the fissures.

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Patent Owner(s)

Patent OwnerAddress
MASSACHUSETTS INSTITUTE OF TECHNOLOGY77 MASSACHUSETTS AVE CAMBRIDGE MA 02142

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Bernstein, Joseph B Potomac, MD 10 93

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