Surface-mountable device for protection against electrostatic damage to electronic components
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United States of America Patent
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-
Feb 20, 2001
Grant Date -
N/A
app pub date -
Feb 23, 1999
filing date -
May 27, 1994
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
The thin film, electrical device is an subminiature overvoltage circuit protection device in a surface mountable configuration for use in printed circuit board or thick film hybrid circuit technology. The surface mountable device (SMD) is designed to protect against electrostatic discharge (ESD) damage to electronic components. The circuit protection device comprises three material subassemblies. The first subassembly generally includes a substrate carrier, electrodes, and terminal pads for connecting the protection device 60 to a PC board. The second subassembly includes a voltage variable polymer material with nonlinear resistance characteristics, and the third subassembly includes a cover coat for protecting other elements of the circuit protection device. The devices of the present invention employ various electrode configurations and profiles to control the electrical field created between the electrodes and increase the active area of the electrodes in contact with the voltage variable material to enhance the electrical characteristics of the device.
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