Prober and electric evaluation method of semiconductor device
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United States of America Patent
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-
Feb 27, 2001
Grant Date -
N/A
app pub date -
Jun 7, 1999
filing date -
Dec 17, 1998
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A prober can make an appropriate evaluation in a microcurrent region. A wafer (9) is disposed on a chuck (8) in a casing (1). In the upper surface of the chuck (8), an electrode (8a) is formed which is connected to a power supply (11) via a wire (10). In the casing (1), a cylindrical electromagnetic shielding box (7) is disposed with the upper surface open. The upper surface of the casing (1) and the side surfaces and bottom surface of the electromagnetic shielding box (7) form a closed space (30) for surrounding the chuck (8) and the wafer (9). Also, a loader (6) for driving the chuck (8) and the electromagnetic shielding box (7) is disposed in the casing (1). On the upper surface of the casing (1), a tester head (3) is disposed with a probe card (4) disposed therein. Since part of the upper surface of the casing (1) is open, probe needles (5) of the probe card (4) protrude into the casing (1) through the opening.
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