Ball grid array R-C network with high density
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United States of America Patent
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-
Feb 27, 2001
Grant Date -
N/A
app pub date -
Mar 18, 1999
filing date -
Mar 18, 1999
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A wave transmission line terminator having application in computer data buss termination, single and multiple channel analog transmission line termination and other similar terminations uses thick film components including resistors and capacitors in combination with a ball grid array termination. The thick film resistors are placed on a first side of a substrate opposite the capacitors and ball grid array, and are electrically connected thereto by electrically conductive vias in the substrate. Several different configurations are disclosed which make the terminator more suitable for specific application.
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