Card assembly of power device in plastic package with external heat sink soldered to the internal heat sink
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United States of America Patent
Stats
-
Feb 27, 2001
Grant Date -
N/A
app pub date -
Dec 15, 1998
filing date -
Dec 16, 1997
priority date (Note) -
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status (Latency Note)
Importance
Abstract
An external heat sink is soldered to an internal heat sink incorporated into the bottom of a molded body of encapsulating resin for a package of an integrated power device. The power device is for surface mounting on a printed circuit board. The internal heat sink has at least a portion protruding from an outer surface of at least one face of the molded body. An external heat sink is mounted on the printed circuit board. The external heat sink has at least a surface abutting with a surface of the body, thus defining a separation gap between at least a surface of the protruding portion of the internal heat sink and an opposing surface of the external heat sink. This separation gap is filled with molten solder alloy during a normal soldering treatment of the printed circuit board.
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