Semiconductor laser array stack package & method of fabrication
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United States of America Patent
Stats
-
Feb 27, 2001
Grant Date -
N/A
app pub date -
Nov 10, 1998
filing date -
Mar 31, 1998
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Semiconductor laser diodes or diode bars are assembled into stacks by a method which permits testing of an entire stack at once and which uses only high temperature solder. The stack includes a plurality of submounts which resemble elongated bars which are square in cross section. Laser diodes (or diode bars) are sandwiched between adjacent submounts. Each submount has an elongated mesa and the mesas are so shaped and positioned in the stack to form a set of ridges which fit into a set of grooves in a substrate. The diodes are bonded to adjacent submounts in a stack simultaneously by reflowing solder preforms (high temperature) in a reflow oven. The stack is secured in place in the grooves of the substrate by reflowing solder placed at the bottom of the grooves.
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