Method for producing printed wiring boards
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United States of America Patent
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-
Mar 6, 2001
Grant Date -
N/A
app pub date -
Sep 5, 1997
filing date -
Sep 6, 1996
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A method for producing printed wiring boards comprises the steps of perforating through holes at predetermined positions in an adhesive insulator sheet, filling the through holes with a conductive material such as a conductive paste or metal balls, transferring conductive wiring patterns that have been formed on surfaces of releasable supporting sheets onto the surfaces of the adhesive insulator sheet by heat and pressure. Simultaneously, interlayer via-connections are performed by means of the conductive material filled into the through holes.
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Cited Art Landscape
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