Lamination machine and method to laminate a coverlay to a microelectronic package
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Mar 6, 2001
Grant Date -
N/A
app pub date -
Apr 15, 1999
filing date -
Apr 15, 1998
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A lamination machine includes means for using gas pressure to bring a coverlay and a microelectronic package into intimate contact and means for heating a coverlay adhesive in order to seal the coverlay to the package. A method of laminating a coverlay to a microelectronic package using the lamination machine includes using gas pressure to bring a coverlay into intimate contact with a microelectronic package. The method also includes heating an adhesive on the coverlay in order to adhere the coverlay to the package. Once the coverlay is laminated to the package, the package can be encapsulated with a curable encapsulant composition. The method may also include decreasing the pressure in the chamber disposed above the package to reduce voids and bubble and/or regulating the pressure in a bladder disposed in a chamber below the package. The lamination machine may also include a pressurized bladder which is used to support the microelectronic package and minimize stress on the leads during the lamination process.
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