Sealing structure for organic light emitting devices
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United States of America Patent
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Mar 6, 2001
Grant Date -
N/A
app pub date -
May 8, 1998
filing date -
Jul 11, 1997
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A sealing structure for an organic light emitting device display. The sealing structure comprises a metal film overlying a dielectric film. The sealing structure has low moisture and oxygen permeability. At least one of the metal layers may react with moisture or oxygen to seal off pin holes. A net low stress sealing structure may be formed by combining tensile and compressive films. The sealing structure may be etched to create openings for connection to outside circuitry. The innovative sealing structure minimizes moisture leakage and vertical shorts between diode cathode and anode.
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