Printed circuit board with capacitors connected between ground layer and power layer patterns
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Mar 6, 2001
Grant Date -
N/A
app pub date -
Mar 9, 1999
filing date -
Mar 16, 1998
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A printed circuit board is disclosed. A top layer power supply pattern and a top layer ground pattern are formed. The top layer power supply pattern and the top layer ground pattern are connected to a power supply layer and a ground layer through a plurality of viaholes, respectively. A plurality of capacitors or a plurality of capacitor resistor series circuits are disposed at predetermined intervals between the top layer power supply pattern and the top layer ground pattern.
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