Autoclave bonding of sputtering target assembly
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United States of America Patent
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-
Mar 13, 2001
Grant Date -
N/A
app pub date -
Sep 25, 1996
filing date -
Nov 24, 1993
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Fabrication techniques for an integrated sputtering target assembly include pressure assisted bonding of soldered layers of material, in particular, soldering of the target material to its backing plate; pressure assisted curing of structural adhesives used to join a finned cover plate to a backing plate which between them form passages for fluid cooling; and bonding an electrical insulating layer to the back surface of the backing plate. The pressure to assist in bonding is typically applied by an autoclave. The cooling fluid passages disposed between a cover and a finned backing plate can be sealed by using laser welding or electron beam welding rather than closing the cooling passages with structural adhesives.
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