Cleaning/buffer apparatus for use in a wafer processing device
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United States of America Patent
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Mar 13, 2001
Grant Date -
N/A
app pub date -
Jan 20, 1998
filing date -
Aug 29, 1996
priority date (Note) -
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status (Latency Note)
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Abstract
A semiconductor processing system, such as a system for buffing or scrubbing both sides of a wafer at the same time, that includes a processing box for use with chemical solutions, a positioning device to position a semiconductor substrate, or other similar semiconductor material or device, and a placement device to place a buffing pad or scrubbing brush.
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